Active and Passive Electronic Components

US$2,495.00
Date of Publication: Feb 7, 2018
This report analyzes the LED Backlight market for Notebook PCs, LCD TVs, Desktop Monitors, Large Others, and Small/Medium LEDs. In analyzes the markets for Lighting, Active Outdoor Displays, Signals, Automotive, Mobile, and others.

US$2,495.00
Date of Publication: Feb 7, 2018
This report discusses the packaging trends for higher performance and density driving advanced packaging technology solutions for mobile and IoT applications. One of the key enabling technologies to achieve these goals is thin 3D-packaging with integration. Developments have lately been made with various embedding technologies, such as eWLB/Fan out WLP and embedded devices. Higher integration levels and lower profiles are also achieved with wafer-level processes, at which most R&D is concentrated in the commercialization of 2.5D IC´s (with silicon interposer) & 3D ICs, as well as coreless substrate. Furthermore, there is tremendous pressure to decrease overall package height even with the additional dies stacking through innovation in wafer thinning, TSV, and ultrathin interconnects.

US$600.00
Date of Publication: Oct 18, 2017
This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry. Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world. The content of this report is based on primary data obtained through interviews, and publicly available information such as corporate financial statements. 

US$3,750.00
Date of Publication: Jan 26, 2018
This study covers the global market for tantalum materials, including tantalum ores and concentrates and engineered tantalum powder, wire, foil, sheet, bar and rod for consumption in tantalum capacitor anodes, tantalum sputtering targets, superalloys, cemented carbide cutting tools, fabricated mill products and tantalum chemicals and compounds. The study forecasts demand for tantalum based upon its “known reliability” and its unique attributes of capacitance, durability, corrosion and heat resistance; as well as its unique optical properties.

US$4,950.00
Date of Publication: Jan 18, 2018
This report analyzes the worldwide markets for Fuses and Circuit Breakers in US$ Million. The Global market is analyzed by the following Product Segments: Fuses, and Circuit Breakers. The report also provides US market analytics for the following End-Use Sectors: Utility, Construction, Industrial Machinery, Electrical & Electronics, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Middle East & Africa, and Latin America. Annual estimates and forecasts are provided for the period 2016 through 2024.

US$2,750.00
Date of Publication: Nov 10, 2017

All major vendors of Passive Components are discussed in this report, including AVX/Kyocera Corporation (NYSE: AVX : RIC 6971:), KEMET Electronics (NYSE: KEM): KOA Corporation (RIC: 6999), Nichicon Corporation (RIC 6996); Nippon Chemi-Con Corporation (RIC: 6997), Panasonic Electronic Devices Company Limited (RIC: 6752), Murata Manufacturing Company Limited (RIC: 6981), Rohm Company Limited (RIC 6963) , Rubycon Corporation (Private), Samsung Electro-Mechanical (KSE: 009150):, Sumida Electric Company Limited (RIC: 6817), Taiyo Yuden Corporation (RIC: 6976), TDK Corporation (RIC: 6762), TOKO Inc. (RIC: 6801), Vishay Intertechnology, Inc. (NYSE: VSH), Walsin Technology (TT: 5335) and Yageo Corporation (TW: 2327).


US$3,750.00
Date of Publication: Jul 24, 2017
This market research report addresses the global market for overvoltage and overcurrent circuit protection components consumed in key areas of the automobile. This includes a detailed analysis of automotive Blade Fuses, PTC Thermistors, TVS Diodes and Polymeric ESD suppressors.