The CD ROM provides a guide to common process defects found at each stage of the SMT process. It also includes defects specifically on printed boards and components. At the first screen you select the process you want to view which gives you an introduction to the processes listed below.
Printed Boards, Components inc; BGA, Screen Print, Adhesive Application, Placement, Reflow Solder, Wave Solder, Cleaning, Rework.
In the case of printed board section it explains the most important issues with surface mount circuits. It then lists common process defects which can be selected to reveal a photographic example of the defect type and an explanation of the possible causes.