The Packaging Cost and Price Model is designed to calculate the manufacturing cost and selling price of most semiconductor packages. The model forward forecasts out to 2025. 75mm to 300mm wafer sizes are supported. Packaging cost, packaging step costs and material usage are calculated.
The IC Knowledge - Strategic Cost Model takes the top three companies in each of four segments and provides a detailed look at all of their current and past processes on 300mm and forward forecasts out to the next decade. Specifically the model covers: DRAM - Samsung, Micron and SK Hynix, Foundry - TSMC, Global Foundries, Samsung, IDM Logic - Intel MPU and ST Micro, NAND - Samsung, Toshiba, and Intel-Micron and 2D and 3D NAND, 3D XPoint for Intel-Micron
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