Electronics Manufacturing


US$160.00
Date of Publication: Jun 15, 2015
Each year, a new slew of terms and definitions become common place in the manufacturing process. To meet these needs, IPC-T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, delivers users the most up-to-date descriptions and illustrations of electronic interconnect industry terminology. It is a dynamic standard that adapts to the industry to provide the most thorough dictionary in the industry.

US$190.00
Date of Publication: Feb 1, 2017
IPC/WHMA A-620 revision C is the latest revision of the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies, and it includes new sections for safety wiring, safety cable, grommets, and raceways along with updated information across many of the sections. With over 700 photographs and illustrations, this standard describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies.

US$4,950.00
Date of Publication: May 24, 2017
This report analyzes the worldwide markets for 3D Printing in US$ Thousand by the following types: 3D Printing Equipment, 3D Printing Services, and Others. The Global market is also analyzed by the following End-Use Segments: Automotive, Aerospace, Consumer Products, Medical, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World.

US$1,350.00
Date of Publication: May 10, 2017
Based on data from 118 electronics assembly companies and PCB fabricators worldwide, this report presents data on the current state (2016) of PCB fabrication and assembly, and the industry’s predictions for the data by 2021. The data are segmented by five applications: automotive, defense and aerospace, high-end systems, industrial and medical electronics. Topics covered include board properties (thickness, layer count, heat dissipation, tolerances), miniaturization (line width and spacing, I/O pitch, via diameters, aspect ratios, via structure, etc.), materials (rigid, flexible, stretchable, metal core, reinforcement, thermal properties, loss characteristics, lead-free, halogen-free, surface finishes, etc.), special structures (embedding, optical channels, chip packages, etc.), printed electronics usage (types, processes, applications and use of 3D printing), traceability, compliance and technical challenges, and general trends.

US$450.00
Date of Publication: Apr 19, 2017
The Germany Electronics Industry Report provides essential market intelligence for all sizes of company from small enterprises to major global groups and for financial/management consultancies, government agencies and academia requiring a reliable overview of the electronics industry in Germany.

US$450.00
Date of Publication: Apr 19, 2017
The Austrian Electronics Industry Report provides essential market intelligence for all sizes of company from small enterprises to major global groups and for financial/management consultancies, government agencies and academia requiring a reliable overview of the electronics industry in Austria.

US$450.00
Date of Publication: Apr 19, 2017
The Belgium Electronics Industry Report provides essential market intelligence for all sizes of company from small enterprises to major global groups and for financial/management consultancies, government agencies and academia requiring a reliable overview of the electronics industry in Belgium.