In any process there are always opportunities to improve the process, reduce the number of process stages or reduce the cost of manufacture. Engineering is always looking at alternative processes, Simultaneous Double Sided Reflow (SDSR) is a possible new candidate to provide cost savings and increased throughput. In simple terms the process involves screen printing and placing components on both sides of the board with the option of using through hole components. Finally the whole assembly is run through a single reflow soldering process to solder both sides of the board and potentially the through components as well. It is currently being considered by two Japanese companies and reported being used by Philips in Europe and a couple of UK companies.
The interactive CD-ROM covers: