IPC 7090-FAM: Packages for PCBs and Assemblies

IPC-7090-FAM: Packages for PCBs and Assemblies

IPC, Date of Publication: Jul 17, 2017
US$533.00
IPC 7090-FAM

IPC 7090-FAM is a family of specifications for design and assembly process implementation for SMT components.

This document collection includes hard copies of:

IPC-7092 Design and Assembly Process Implementation for Embedded Components

IPC-7093 Design and Assembly Process Implementation for Bottom Termination Components

IPC-7094 Design and Assembly Process Implementation for Flip Chip and Die Size Components

IPC-7095 Design and Assembly Process Implementation for BGAs

Additional Information:
Collection of IPC documents
Date of Publication:
Jul 17, 2017
File Format:
Printed Copies