Now updated to Revision F of the latest IPC-A-610 this Training & Reference Guide illustrates critical acceptance criteria for the evaluation of surface mount solder connections.
At only 44 pages and a compact 5.5 x 8.5 inch (14 x 21.5 cm) size, these convenient spiral-bound manuals make it easy for your inspectors and operators to make the right solder joint acceptance decisions for all three classes of product.
Useful as a training aid in the classroom or on the shop floor, DRM-SMT contains computer generated color illustrations of Chip component, Gull Wing and J-Lead solder joints. Each drawing clearly shows the minimum acceptable condition for each type of component misalignment; and details all of the specifications for minimum/maximum solder joint size, including fillet heights and lengths.
This updated guide also covers solder joint quality standards for two new Area Array component types, Ball Grid Arrays (BGAs) and Bottom Termination Components (BTCs).
DRM-SMT-F also contains high quality color microphotographs of the major solder defects and conditions such as nonwetting, solder bridging and disturbed joints, including samples of both tin-lead and lead-free solder connections. The appropriate specification/paragraph references from the IPC-A-610F are included for each of the acceptance criteria for further verification.