IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies

IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies with Amendment 1

IPC, Date of Publication: May 12, 2016, 84 Pages

Table Of Contents

This IPC J-STD-001F now comes with Amendment 1 in a new format J-STD-001F-WAM1

J-STD-001F with Amendment 1 incorporates the requirements of J-STD-001F and J-STD-001F Amendment 1 into one document. Criteria are presented in a seamless J-STD-001 format, and there are no redline marks. This document is the equivalent to using J-STD-001F and J-STD-001F Amendment 1. IPC brings this version to industry to minimize confusion for those using both documents and those wishing to update their documentation with the latest available format.

DoD Adopted! IPC J-STD-001F is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This revision includes support for both traditional solder alloys and for lead-free manufacturing. Examples of some of the significant changes are revision to plated-through hole, PTH, minimum fill requirements; criteria for two new SMT termination types; and expanded conformal coating criteria. Whenever possible, the criteria descriptions have been adjusted to make them easier to understand for materials, methods and verification for producing quality soldered interconnections and assemblies. The requirements for all three classes of construction are included. Full-color illustrations are provided for clarity. This standard fully complements IPC-A-610F and is supported by IPC-HDBK-001. This standard fully complements IPC-A-610F in its new format IPC-A-610F-WAM1.


Date of Publication:
May 12, 2016
File Format:
PDF Download, Print Copy
Number of Pages:
84 Pages