This study provides the top vendor rankings for the worldwide mobile phone chipset and connectivity semiconductor market for the fourth calendar quarter of 2016. This is a quarterly deliverable that tracks the top mobile phone semiconductor vendors in several key device categories and is broken out by:
The top 13 worldwide mobile phone semiconductor vendors for 4Q15, 3Q16, and 4Q16. Select components include chipsets, discrete applications processors, baseband and integrated baseband processors, radio frequency (RF), and connectivity technologies.
The top worldwide mobile phone connectivity semiconductor vendors for 4Q15, 3Q16, and 4Q16. Connectivity chips include WiFi, Bluetooth, broadcast radio, GPS, mobile TV, and NFC.
The top worldwide mobile subsystem vendors for 4Q15, 3Q16, and 4Q16. Mobile subsystems in this study include discrete baseband processors, integrated baseband processors, discrete application processors, baseband analog integrated circuits (ICs), power amplifiers, transceivers, and connectivity.
Vendor competition in the merchant silicon vendor landscape and the continued increase in share of captive silicon vendors such as Samsung, HiSilicon, and Apple continue to be a challenge on ASPs; however, we believe that price declines may be far less benign than that experienced over the past two years post-consolidation and as operating models of companies are refocused on profitability.