Outsourced Semiconductor Assembly and Test Market (OSAT) Market Trends

Outsourced Semiconductor Assembly and Test Market (OSAT) Market Trends

Global Industry Analysts, Date of Publication: Mar 25, 2014, 16 Pages

The Outsourced Semiconductor Assembly and Test Services market is projected to witness significant upsurge, primarily driven by the increase in packaging costs and a rapid transformation towards the adoption of outsourcing model in the coming years.

The report analyzes and presents an overview of Outsourced Semiconductor Assembly and Test market worldwide. The report in addition provides global market estimates and projections in US dollars for Outsourced Semiconductor Assembly and Test (OSAT) for years 2012 through 2017. Supported with 2 market data tables, the report provides a review of market trends, growth drivers, and various strategic industry activities of major companies witnessed by the industry over the last few years. In addition, 37 companies operating in the Outsourced Semiconductor Assembly and Test market worldwide including Amkor Technology, BE Semiconductor Industries, Cirtek Electronics Corporation, Denis Ferranti Group, IBM Microelectronics, PSI Technologies, STATS ChipPAC, Toshiba Semiconductor & Storage Products Company, Unisem (M) Bhd, and others are profiled.


Market Scenario 1
Table 1: Global Outsourced Semiconductor Assembly and Test
Market (OSAT) (2012-2017) in US$ Million 2

Table 2: Outsourced Semiconductor Assembly and Test Market
(OSAT) Worldwide by Company (2012): Percentage Share
Breakdown by Value Sales for Advanced Semiconductor
Engineering, Inc.; Amkor Technology, Inc.; Siliconware
Precision Industries Co., Ltd.; STATS ChipPac Ltd.; ChipMOS
TECHNOLOGIES (Bermuda) Ltd.; and Others 3
Back-end Manufacturing Processes Provide Impetus to
Outsourced Semiconductor Assembly and Test Companies 3
Major Growth Drivers 4
Increased Adoption of Packaging and Assembly Technologies in
Diversified Electronic and Portable Devices 4
Rapid Expansion of Outsourced Semiconductor Assembly and Test
Companies in Southeast Asia 4
Electronic Outsourcing Services Industry Fails to Address
Demand of Middle Market 4
Japanese Chipmakers Turn towards Outsourcing of Assembly &
Test Processes 5

Amkor Signs MoU with Toshiba to Take Over Toshiba Electronics
Malaysia 6
ASE Assembly & Test (Shanghai) to Take Over Wuxi Tongzhi
Microelectronics 6
Renesas Electronics Inks MoU with J-Devices 6
STATS ChipPAC and UMC Microelectronics Introduce Advanced 3D
IC Chip Stacking Technology 6
Shinko Electric Industries Obtains License to Use TMV®
Technology of Amkor Technology 7
Salland Engineering International and Pintail Technologies Merge 7
Dynamic Test Solutions and Tessolve Services Sign Merger
Agreement 7

Advanced Semiconductor Engineering, Inc. (Taiwan) 9
Amkor Technology, Inc. (USA) 9
Ardentec Corp. (Taiwan) 9
ASE Assembly & Test (Shanghai) Ltd. (China) 9
Automated Technology (Phil), Inc. (Philippines) 10
BE Semiconductor Industries N.V. (The Netherlands) 10
Carsem (M) Sdn. Bhd. (Malaysia) 10
ChipMOS Technologies (Bermuda) LTD. (Taiwan) 10
Cirtek Electronics Corporation (Philippines) 10
Denis Ferranti Group (UK) 10
Dynamic Test Solutions Asia Pte., Ltd. (Singapore) 11
EEMS Italia SpA (Italy) 11
GEM Services, Inc. (China) 11
IBM Microelectronics (USA) 11
J-DEVICES Corporation (Japan) 11
King Yuan Electronics Co., Ltd. (Taiwan) 11
Kulicke & Soffa Industries, Inc. (Singapore) 12
Lingsen Precision Industries, Ltd. (Taiwan) 12
LTX-Credence Corporation (USA) 12
Orient Semiconductor Electronics (Taiwan) 12
Powertech Technology, Inc. (Taiwan) 12
PSI Technologies, Inc. (Philippines) 12
Salland Engineering International (The Netherlands) 13
Signetics Corporation (Korea) 13
Siliconware Precision Industries Co., Ltd. (Taiwan) 13
SPEL Semiconductor Ltd. (India) 13
Stars Microelectronics (Thailand) Public Company Ltd. (Thailand) 13
STATS ChipPAC, Ltd. (Singapore) 13
Tektronix Component Solutions (USA) 14
Tessolve Services Pvt. Ltd. (India) 14
Tianshui Huatian Microelectronics Co., Ltd. (China) 14
Tong Hsing Electronic Industries Ltd. (Taiwan) 14
Toshiba Semiconductor & Storage Products Company (Japan) 14
Unisem (M) Bhd. (Malaysia) 14
United Microelectronics Corporation (Taiwan) 14
United Test and Assembly Center Ltd. (Singapore) 15
Youngtek Electronics Corporation (YTEC) (Taiwan) 15

Additional Information:
This report is offered in PDF format via e-mail. Once downloaded, the PDF can’t be copied to another computer. The user is permitted to print one full copy of the report. Extra copies or licenses may be purchased at 10% of the list price.
Date of Publication:
Mar 25, 2014
File Format:
PDF via E-mail
Number of Pages:
16 Pages