Semiconductor Manufacturing

US$1,300.00
Date of Publication: Nov 24, 2017
The IC Knowledge - 300mm watch database provides detailed coverage of all of the operating and announced 300mm fabs in the world. Details around location, products, key dates, investment and output versus year are all provided. There are also a number of graphs summarizing and analyzing output, capacity and cost out through 2025.

US$2,150.00
Date of Publication: Nov 24, 2017
The Discrete and Power Products Cost and Price Model - new revision has now been released with new processes and other enhancements. Easily calculate the cost and price of high power silicon ICs and discrete devices with only 5 required selections/entries. The model supports over 260 processes and over 70 package types. All of our models include twelve month of updates with reasonable email and phone support.

US$5,000.00
Date of Publication: Nov 24, 2017

The IC Knowledge - Strategic Cost Model takes the top three companies in each of four segments and provides a detailed look at all of their current and past processes on 300mm and forward forecasts out to the next decade. Specifically the model covers: DRAM - Samsung, Micron and SK Hynix, Foundry - TSMC, Global Foundries, Samsung, IDM Logic - Intel MPU and ST Micro, NAND - Samsung, Toshiba, and Intel-Micron and 2D and 3D NAND, 3D XPoint for Intel-Micron


US$1,900.00
Date of Publication: Nov 24, 2017
The IC Knowledge - MEMS Cost Model is the industry standard for cost modeling of MEMS products. Very easy to use tech model allows for up to two MEMS and up to two integrated circuit die in the same package providing a full MEMS product solution. The model then presents a detailed analysis of cost. The model supports both pre-defined and user defined products, processes and process steps. Cost includes wafer fabrication, wafer test, packaging and final test..

US$800.00
Date of Publication: Nov 8, 2017
The report finds the Taiwanese fabless IC industry's shipment value grew sequentially to about USD437 million in the second quarter of 2017. When it comes to the application of fabless ICs, nearly 38% of ICs are used in communications, followed by nearly 35% in consumer electronics.

US$800.00
Date of Publication: Nov 8, 2017
The report finds that the the Taiwanese semiconductor manufacturing industry comprising mainly of foundry, DRAM, flah memory, and IDM sectors grew sequentially but declined year-on-year in the second quarter of 2017. With the increasing share of high-end models and the considerable growth in memories made using advanced process technology, the industry's shipment value is projected to have reached USD11.3 billion in the third quarter of 2017 and peak in the last quarter to around USD14.2 billion.

US$2,495.00
Date of Publication: Oct 18, 2017
This report discusses the packaging trends for higher performance and density driving advanced packaging technology solutions for mobile and IoT applications. One of the key enabling technologies to achieve these goals is thin 3D-packaging with integration. Developments have lately been made with various embedding technologies, such as eWLB/Fan out WLP and embedded devices. Higher integration levels and lower profiles are also achieved with wafer-level processes, at which most R&D is concentrated in the commercialization of 2.5D IC´s (with silicon interposer) & 3D ICs, as well as coreless substrate. Furthermore, there is tremendous pressure to decrease overall package height even with the additional dies stacking through innovation in wafer thinning, TSV, and ultrathin interconnects.