The Graphene Report is a comprehensive analysis of the market and commercial opportunities for these remarkable materials. This new edition has greatly expanded the sections covering flexible electronics, wearables and energy and details on industry demand in tons (current and projected) has been added for key markets.
The Packaging Cost and Price Model is designed to calculate the manufacturing cost and selling price of most semiconductor packages. The model forward forecasts out to 2025. 75mm to 300mm wafer sizes are supported. Packaging cost, packaging step costs and material usage are calculated.
This report focuses on the entire hard disk drive market food chain, analyzing the markets for hard disk drives, substrates, and thin film heads. Processing issues in the manufacture of each of these sectors in included and the report details the CMP and Lithography sectors of thin film head processing. Market forecasts and market shares of all sectors are detailed. The SSD market is also analyzed.
Electronics.ca provides focused market intelligence to its users by
categorizing all contents based on main areas of interest which currently influence the electronics industry.
© 1997-2018 Electronics.ca Publications, Inc..