Technology, Equipment and Materials

US$190.00
Date of Publication: Nov 2, 2017
IPC-A-610G, Acceptability of Electronic Assemblies, is a post-assembly acceptance standard used to ensure electronic assemblies meet acceptance requirements for the electronics industry.

US$613.00
Date of Publication: Jul 17, 2017

IPC-6010-FAM, "Printed Board Performance Specifications" includes qualification and performance specification standards for all major types of printed boards.


US$420.00
Date of Publication: Jul 17, 2017

CoatBdsAssyFAM: Coating Specifications for Boards and Assemblies. This is a family of IPC documents for coatings used in the printed board fabrication and assembly processes.


US$533.00
Date of Publication: Jul 17, 2017
7090-FAM, IPC 7090-FAM is a family of specifications for design and assembly process implementation for SMT components.

US$702.00
Date of Publication: Jul 17, 2017
"Base Materials Specifications for Printed Boards", BdMATFAM - is a family of specifications for board materials used in the fabrication process.

US$160.00
Date of Publication: Jun 15, 2015
Each year, a new slew of terms and definitions become common place in the manufacturing process. To meet these needs, IPC-T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, delivers users the most up-to-date descriptions and illustrations of electronic interconnect industry terminology. It is a dynamic standard that adapts to the industry to provide the most thorough dictionary in the industry.

US$4,950.00
Date of Publication: May 24, 2017
This report analyzes the worldwide markets for 3D Printing in US$ Thousand by the following types: 3D Printing Equipment, 3D Printing Services, and Others. The Global market is also analyzed by the following End-Use Segments: Automotive, Aerospace, Consumer Products, Medical, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World.