Thin Film Deposition: Trends, Key Issues, Market Analysis

Thin Film Deposition: Trends, Key Issues, Market Analysis

Information Network, Date of Publication: Feb 7, 2018, 198 Pages

Thin film deposition processes play a critical role in the production of high-density, high-performance microelectronic products. Considerable progress has been achieved in the development of deposition processes -- and in the development of the reactor systems in which they are carried out. This report discusses the technology trends, products, applications, and suppliers of materials and equipment. It also gives  insights  to  suppliers  for future user needs and should assist them in long range planning, new  product development  and  product  improvement.  

This report compares some of the issues impacting users of different deposition tools, including: APCVD (SACVD), LPCVD, PECVD, HDPCVD, ALCVD, PVD, ALD. Market forecasts and market shares of vendors is presented.

Thin Film Deposition: Trends, Key Issues, Market Analysis

Chapter 1 Introduction

Chapter 2 Executive Summary

Chapter 3 Physical Vapor Deposition

3.1 Introduction
3.2 Sputtering Technology
3.3 Plasma Technology
3.4 Reactor Designs
3.4.1 Long-Throw Deposition
3.4.2 Collimated Sputter Deposition
3.4.3 Showerhead Deposition
3.4.4 Ionized PVD
3.5 Semiconductor Processing
3.5.1 Feature Patterning
3.5.2 Gap Fill
3.6 Targets

Chapter 4 Chemical Vapor Deposition

4.1 Introduction
4.2 Chemical Vapor Deposition (CVD) Techniques
4.2.1 APCVD
4.2.2 LPCVD
4.2.3 PECVD
4.2.4 HDPCVD
4.2.5 ALD

Chapter 5 Electrochemical Deposition

5.1 Introduction
5.2 Reactor Design
5.3 Challenges
5.4 Additives
5.5 Processing
5.5.1 Superfilling
5.5.2 Aspect Ratios
5.6 Copper Cathodes
5.7 Wet Copper Seed-Layer

Chapter 6 Film Deposition And Film Properties

6.1 Introduction
6.2 Dielectric Deposition
6.2.1 Silicon Dioxide Thermal CVD PECVD HDPCVD
6.2.2 Silicon Nitride Thermal CVD PECVD HDPCVD
6.2.3 High-K Dielectrics
6.2.4 Low-K Dielectrics
6.3 Metal Deposition
6.3.1 Aluminum
6.3.2 Tungsten/Tungsten Silicide
6.3.3 Titanium Nitride

Chapter 7 Vendor Issues

7.1 Introduction
7.2 450mm Processing
7.3 Integrated Processing
7.4 Copper
7.5 Metrology
7.6 ESD
7.7 Parametric Test

Chapter 8 Market Forecast

8.1 Introduction
8.2 Key Issues
8.3 Market Forecast Assumptions
8.4 Market Forecast
8.4.1 Chemical Vapor Deposition
8.4.2 Physical Vapor Deposition
8.4.3 Copper Electroplating Market
8.4.4 Atomic Layer Deposition Market

List of Figures

3.1 Schematic Of Sputtering System
3.2 Magnetron Sputtering Design
3.3 Showerhead Reactor Design
3.4 Ionized PVD
4.1 APCVD Reactor
4.2 Tube CVD Reactor
4.3 HDPCVD Reactor
4.4 ALD Versus PVD Copper Barrier
5.1 Copper Electroplating System
7.1 Comparison Between Semiconductor and Equipment Revenues
8.1 Worldwide MCVD Market Shares
8.2 Worldwide DCVD Market Shares
8.3 Worldwide DCVD Market By Sectors
8.4 Worldwide HDHCVD Market Shares
8.5 Worldwide PECVD Market Shares
8.6 Worldwide SACVD Market Shares
8.7 Worldwide LPCVD Market Shares
8.8 Worldwide PVD Market Shares
8.9 Worldwide ECD Market Shares
8.10 Worldwide ALD Market Shares

List of Tables

8.1 Worldwide CVD Market Forecast
8.2 Worldwide MCVD Market Shares
8.3 Worldwide DCVD Market Shares
8.4 Worldwide HDPCVD Market Forecast
8.5 Worldwide HDPCVD Market Shares
8.6 Worldwide PECVD Market Forecast
8.7 Worldwide PECVD Market Shares
8.8 Worldwide SACVD Market Forecast
8.9 Worldwide SACVD Market Shares
8.10 Worldwide LPCVD Market Forecast
8.11 Worldwide LPCVD Market Shares
8.12 Worldwide PVD Market Forecast
8.13 Worldwide PVD Market Shares
8.14 Worldwide ECD Market Forecast
8.15 Worldwide ALD Market Forecast

Date of Publication:
Feb 7, 2018
File Format:
PDF via E-mail
Number of Pages:
198 Pages