Wafer Fabrication Plants

Date of Publication: Jan 23, 2017
The IC Knowledge - 300mm watch database provides detailed coverage of all of the operating and announced 300mm fabs in the world. Details around location, products, key dates, investment and output versus year are all provided. There are also a number of graphs summarizing and analyzing output, capacity and cost out through 2025.

Date of Publication: Oct 24, 2016
This research report presents shipment value forecast and recent quarter review of the Taiwanese semiconductor manufacturing industry. Companies surveyed in this research are those owning facilities to make MOS (Metal Oxide Semiconductor) wafers in Taiwan, including IC foundries, DRAM (Dynamic Random Access Memory) vendors, and IDM (Integrated Device Manufacture) companies. The content of this report is based on primary data obtained through interviews, and publicly available information such as corporate financial statements.

Date of Publication: Jul 24, 2015
This report provides: Analysis of global semiconductor market and industry, Analysis of Chinese semiconductor market and industry, Analysis of global and China foundry industry, Study of 16 foundry vendors. Global foundry industry was worth about USD46.1 billion in 2014, up 18.2% from 2013, and is expected to reach USD52.8 billion in 2015, a year-on-year growth of 14.5%, and USD58.3 billion in 2016, rising by 6.4% against 2015, and increase by just 3.7% in 2017.

Date of Publication: Nov 19, 2012
This report analyzes the worldwide markets for Semiconductor Foundry in US$ Million by the following Application Segments: Telecommunications, Computers, Consumer Electronics, and Others. The report provides separate comprehensive analytics for the US, China, Taiwan, and Rest of World. Annual estimates and forecasts are provided for the period 2010 through 2018. A six-year historic analysis is also provided for these markets. The report profiles 51 companies including many key and niche players such as Dongbu HiTek Co., Ltd., GlobalFoundries, Inc., Grace Semiconductor Manufacturing Corporation, HeJian Technology (Suzhou) Co., Ltd., Kawasaki Microelectronics, Inc., MagnaChip Semiconductor Corporation, Samsung Electronics, Co., Ltd., Semiconductor Manufacturing International Corporation, Taiwan Semiconductor Manufacturing Company Limited, Tower Semiconductor Ltd., United Microelectronics Corporation, Vanguard International Semiconductor Corporation, and X-FAB Semiconductor Foundries AG.